| Product Name | 1.0MM PITCH 501330 CONNECTOR DOUBLE ROW TYPE |
| Part Number Prefix | XD-501330 |
| Pitch | 1.0 mm |
| Type | WTB SMT CONN, Single Row, With Buckle |
| Applicable Standards | GB/T2421, GB/T2423, GB/T2424, GB/T5095 |
| Operating Temperature Range | -25 to +85 |
| Applicable Wire Sizes | AWG #28 to #32 |
| Applicable PC Board Thickness | 0.6mm to 1.2mm |
| Current Rating | 1A AC, DC |
| Voltage Rating (General) | 100V AC, DC |
| Voltage Rating (Withstand) | 250V AC/minute (Adjacent terminals), 300V AC/minute (Terminal to ground) |
| Contact Resistance (Initial) | 20m |
| Contact Resistance (After Test) | 40m |
| Insulation Resistance | 100 M |
| Pin Retention Force | 6N (AWG #32), 8N (AWG #30), 13N (AWG #28) |
| Terminal Crimping Wire Strength | 2.5N (AWG #28) |
| Single Contact Withdrawal Force | 0.3N |
| Single Contact Insertion Force | 1.5N |
| Fixed Terminals and Seat Force | 5N |
| Vibration Test | Frequency: 10-55-10 Hz/min, Amplitude: 1.5mm p-p, Duration: 2 hours per axis |
| Durability Cycles | 30 cycles |
| Thermal Aging | 852 for 96 hours |
| Temperature Cycling | 5 cycles (-55 to +85) |
| Humidity Test | 402, 90-95% RH for 96 hours |
| Salt Spray Test | 353, 51% solution; 8 hours (plated) or 24 hours (unplated) |
| Solder Ability | 2455 for 30.5S (Tin plating) |
| Resistance to Soldering Heat (Manual) | 3505 for 30.5S |
| Resistance to Soldering Heat (Wave) | 2605 for 50.5S |
| Resistance to Soldering Heat (Reflow) | 2555 for 20S Max |
| Reflow Temperature Curve | Refer to Section 9.1 |
| Packaging | Tape reel, tube, tray packaging; carton exterior with packing list |
| Storage Temperature | -20 to +40 |
| Storage Humidity | 80% RH |
| Transportation Temperature | -20 to +50 |
