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Thermoplastic Housing Horizontal Single Row Socket 314 Positions 0.50mm Pitch FOXCONN AS-0B821-S78B-7H

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Thermoplastic Housing Horizontal Single Row Socket 314 Positions 0.50mm Pitch FOXCONN AS-0B821-S78B-7H

Operating Temperature : -55℃~+85℃

Pitch : 0.5mm

Current Rating : 500mA

Voltage Rating (Max) : 25V

Contact Plating :

Contact Material : 铜合金

Description : -55℃~+85℃ 0.5mm 500mA 25V FFC, FPC (Flat Flexible) Connector Assemblies RoHS

Mfr. Part # : AS-0B821-S78B-7H

Model Number : AS-0B821-S78B-7H

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Product Overview

The AS Series MXM 3.0 Socket is designed for memory module applications. It features a 0.50mm pitch and 314 positions, available in SMT type with varying heights (4.3mm, 5.5mm, 7.8mm). This socket is constructed with a thermoplastic housing rated UL 94V-0 in Ivory color, and copper alloy contacts and metal springs. It offers a voltage rating of 25V and a current rating of 0.5A, with a contact resistance of 55m max. The operating temperature range is -55 to +85.

Product Attributes

  • Housing Material: Thermoplastic, UL 94V-0 rated
  • Housing Color: Ivory
  • Contact Material: Copper alloy
  • Metal Spring Material: Copper alloy
  • Certifications: UL 94V-0 rated
  • Type: Horizontal Type, Single Row

Technical Specifications

Specification Details
Socket Type MXM 3.0
Series AS Series
Height Options 4.3mm, 5.5mm, 7.8mm
Mounting Type SMT Type
Pitch 0.50mm
Number of Positions 314 Pos. (B8)
Contact Retention Force 0.10kg min.
Durability 25 Cycles
Voltage Rating 25V
Current Rating 0.5A
Contact Resistance 55m max.
Dielectric Withstanding Voltage 200V AC/1 min.
Insulation Resistance 100M
Operating Temperature -55 to +85
Contact Area Plating Options Gold Flash (1), 10u" Gold plating (6)
Package Code Options Soft Tray (4), Carrier tape (7)
Color Option Black Color (B)

All specifications and dimensions are subject to change. Please contact your nearest Foxconn sales representative for update information.


2411201845_FOXCONN-AS-0B821-S78B-7H_C2892103.pdf


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